AI-NATIVE AOI AND SPI

Delvitech's patented optical heads gather ultra-precise 3D data and high-resolution images. Powered by proprietary neural networks and patented optical heads, the system adapts to any surface, height, or material, delivering clear results across a wide spectrum of components, from reflective metals to shadowed zones, tall connectors, and fine-pitch elements. And it keeps learning, cycle after cycle.

For high-throughput environments, the XP element enables fast-paced inspection at 0.4 sec/FoV. The HD element delivers ultra-high-resolution imaging, ideal for microelectronics and detailed assemblies. DUO introduces a dual-lane conveyor to optimize board handling and increase line efficiency, while the ITU element supports double-sided inspection by rotating PCBs along the X axis. With Horus, your AOI system scales to match your evolving workflow.

40 Gbit in 1 second. Thinks faster than you blink. Horus processes over 40 gigabytes of inspection data in 1''. From component location and polarity to pin contours and solder joint analysis, every detail is captured with exceptional clarity. Integrated OCR and full 360° inspection ensure compliance with IPC standards, while true 3D optical technology, linear motor-driven heads, and lightning-fast board handling push performance beyond the limits of traditional systems.

Up to 60 mm. Clearance for every project. With generous top and bottom clearance and support for boards up to 560 × 550 mm, Horus handles even the most complex assemblies, offering unmatched flexibility for any production line.

Delvitech’s patented optical heads gather ultra-precise 3D data and high-resolution images. Powered by proprietary neural networks and patented optical heads, the system adapts to any surface, height, or material, delivering clear results across a wide spectrum of components, from reflective metals to shadowed zones, tall connectors, and fine-pitch elements. And it keeps learning, cycle after cycle.

For high-throughput environments, the XP element enables fast-paced inspection at 0.7 sec/FoV. The HD element delivers ultra-high-resolution imaging, ideal for microelectronics and detailed assemblies. DUO introduces a dual-lane conveyor to optimize board handling and increase line efficiency, while the ITU element supports double-sided inspection by rotating PCBs along the X axis. With Horus, your AOI system scales to match your evolving workflow.

Horus processes over 40 gigabytes of inspection data in 1’’. From component location and polarity to pin contours and solder joint analysis, every detail is captured with exceptional clarity. Integrated OCR and full 360° inspection ensure compliance with IPC standards, while true 3D optical technology, linear motor-driven heads, and lightning-fast board handling push performance beyond the limits of traditional systems.

With generous top and bottom clearance and support for boards up to 560 × 550 mm, Horus handles even the most complex assemblies, offering unmatched flexibility for any production line.

Engineered for height variation. Thanks to its adaptive Z-axis movement and advanced optical head, Aton is ideal for special applications where components of varying heights must be inspected. The system offers dynamic focus adjustment across an 80 mm range, enabling precise analysis of boards with components reaching up to 140 mm in height.

Bottom clearance up to 140mm. Aton is built to handle even the tallest components, with top clearance up to 120 mm, bottom clearance up to 140 mm and boards up to 10 kg. Whether you're inspecting tall connectors, reflective materials, or irregular geometries, Aton gives you the space - and the precision - to do it right.

The patented Delvitech optical head with 6 cameras is a powerful technology that acquires precise 3D data with crystal clear images for a wide range of packages and components. From tall connectors with reflective metallic surfaces to fine pitch components, Aton provides a reliable and consistent performance to cover all scenarios in SMT and THT*.